Backgrind waste is produced during the backgrinding process in semiconductor manufacturing. This process involves thinning the semiconductor wafer to achieve the desired thickness. The waste comprises various materials, including silicon, epoxy resin, abrasive particles, and coolants.
The Backgrind waste treatment system utilises various processes and technologies to handle and treat backgrind waste effectively. The waste is collected and sorted based on its composition and characteristics. Specific treatment methods are used for different types of waste, such as silicon slurry, epoxy resin, or coolant.
Solid-liquid separation is performed to separate the solid particles from the waste. BW Water typically uses techniques like coagulation, flocculation, and sedimentation, where agents are added to the clarified liquid to induce the coagulation, flocculation, and sedimentation of dissolved contaminants. This step aids in separating heavy metals, organic compounds, and other pollutants from the liquid phase.
